Laser Precision Welding: electronic components manufacturing process requires welding, seal welding, stitch welding, due to the continued miniaturization of components, requiring small joints, weld strength, weld heat-affected zone on the surrounding small. Traditional welding process is difficult to meet the needs, laser welding can be achieved. CRT electron gun assembly with laser welding process, the quality greatly improved, now almost all color picture tube production line spot welding machine equipped with a pulsed laser. Computer keyboard key words using laser welding process allows the reed hitting life of more than 20 million times. Small air sealed relay laser welding process, its leakage rate. Some technical problem of 5mW laser pointer should be analyzed.
There are many coaxial optical communication devices, such as optical isolators, fiber couplers, etc., in order to ensure the optical signal attenuation is less than 0.1db, requires the circumference of the device in the welding distortion is less than 1μm, 0.2μm center offset is less than . Must be synchronized using multi-point along the circumference welding, laser beam is easy to go through after transmission through the fiber optic multi-point synchronization processing, the energy can be precise control of the traditional processing methods to solve difficult problems. Multilayer PCB laser drilling precision: ever-increasing integration of microelectronic circuits, in order to improve the circuit board wiring density, to use the multi-layer circuit board. Therefore, the micro-channel layer interconnect technology reveal the importance of increasing. Channel diameter is generally 0.025 ~ 0.25mm, with the traditional mechanical drilling or punching process is not only expensive, difficult to guarantee the quality, not to the blind hole machining. The company plans to hire 2 more supply managers ofGreen laser pointer.
Not only can the laser processing of high quality holes and blind holes, and holes of arbitrary shape can be processed or contour cutting board. UV laser processing of polymer materials and is ideal for copper. Excimer lasers are large, the working gas is corrosive and difficult to maintain, in the electronics industry has not been widely used; with diode-pumped solid state laser technology, rapid development, there has been full curing of UV lasers, not only small, and long life. U.S. COHERENT produced UV laser: AVIA 355-1500 type of laser, can be under the control of the computer system by scanning galvanometer circuit board drilling, cutting, and other fine engraved lines or processing; in 50μ thick polyimide film play on the hole diameter of 30μ, about 250 per second can play the hole. The purchase of 100mW laser pointer has the strict management requirements.
Laser tag: engraving and laser marking are two ways to mask imaging: cover model marked with a laser imaging to the template pattern and ablation of the surface markers, laser source with TEACO2 lasers. Sculpture markup is a full-featured high-speed marking system, laser light source with the sound of Q-quasi-continuous wave Nd: YAG laser / pulsed ytterbium-doped fiber laser / RF CO2 laser /. The two-dimensional optical scanning laser beam after reflection by the galvanometer flat field optical lens to focus to the surface, under computer control to set the trajectory of the material by vaporization, standard carve graphics or text. Laser marking is permanent, easy to wear. Have been widely used in foreign countries to the electronic components, integrated circuits fight trademark, model; to the printed circuit board to play number. In recent years, UV laser technology has developed rapidly, due to the material under the action of ultraviolet wave laser electron band transitions, to break or weaken the bond between molecules, in order to achieve erosion process, the edge of a very neat process, so the sudden emergence of laser marking technology particular attention by the microelectronics industry. The supply manager ofgreen laster pointeracts well.
Laser-assisted cleaning: For sub-micron semiconductor devices, the particulate pollution in the manufacturing process can cause a fatal flaw, dust size and device width is only 1 / 3 or even 1 / 10 may result in device failure. Traditional ultrasonic cleaning is difficult to remove micron and smaller size particles. With laser-assisted cleaning technology is the mechanism to solve this problem: First, by using laser light to be clean material, particulate or surface absorption of laser energy, the force generated due to thermal diffusion impact will leave the surface of the particles. Second, the 200mW Laser Pointer energy by particles around and following cleaning agent (water) absorption, leading to cleaner heating and explosively rapid vaporization of the particles away from the surface. The technical problem of Blue Laser Pointer successfully solved.
